HP accelerates digital reinvention for 3D Printing

At the Additive Manufacturing Users Group (AMUG) conference, HP Inc. has announced the significant milestones to its open platform for 3D printing materials and production-ready applications development. HP’s unique open platform model for 3D printing helps expand the availability of new materials and addresses a broader set of applications. The model also helps lower materials and development costs, drive speed and performance improvements, and create new possibilities for part properties meeting specific industry needs.

HP, in collaboration with SIGMADESIGN, will offer MDK for 3D printing materials, ensuring a robust and expanding array of materials for end-customers and a simplified certification and testing process for partners.

The new HP 3D Open Materials and Applications Lab will offer partners a range of equipment and in-house expertise to accelerate materials and applications innovation, which is critical to quickening the evolution and adoption of 3D printing technologies.

Global materials leaders and existing HP partners, BASF and Evonik shared details about new innovations being developed using HP’s open platform and the opportunity to work in the new HP 3D Open Materials and Applications Lab.