Nano Dimension files patent application

Nano Dimension files patent application
Nano Dimension files patent application

Nano Dimension Ltd., a specialist in the area of 3D Printed Electronics, has recently declared that Nano Dimension Technologies, a fully owned subsidiary of Nano Dimension, has filed a patent application with the U.S. Patent and Trademark Office for the printing of shielded conductors combined in a printed circuit board (PCB). The patent presents an innovative solution for the phenomenon of electric power loss in PCBs that are primarily used in the communication industry.

Nano Dimension has developed an exclusive 3D printing method that creates printed sheaths to shield the conductors like a form of insulated cable, and this new printing method allows the sheaths to be built into the PCB object.

This new approach creates the opportunity to minimize the size of PCBs used in the high speed communication space. By selectively depositing Nano Dimension’s conductive ink, one can build a shield along the entire length of the conductor at a minimal distance. This prevents leakage and loss and is similar to the current practice of using shielded cables with the PCB externally. 3D printing allows the shielded cables to be embedded. High-speed boards are essential to the telecom industry and are a component of the rigid servers that allow real-time Big Data implementations.