Nano Dimension Ltd., a leader in the field of 3D printed electronics, has announced that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has developed novel copper nanoparticles that are resistant to oxidation and fuse into a conductive line after sintering process at temperatures lower than 160 °C.
The main challenge in developing nano-copper ink is oxidation of the particles, including oxidation during sintering into a continuous conductive trace. Typically, sintering of copper nanoparticles requires significant energy (high temperatures, lasers, powerful lamps) in an oxygen-free atmosphere, which can be an expensive and complex process.
Nano Dimension has developed novel copper nanoparticles that are resistant to oxidation in air, and also during the sintering process that is required to create a continuous conductive trace. The innovative copper nanoparticles are packed into a unique spherical cluster and are used as a basis to develop conductive ink that can significantly reduce the cost of the raw-materials used in 3D printing of electronics and PCBs.