CBN use DragonFly system for electrical packaging

3D embedded sensor in electrical packaging (bottom image) as compared with traditional packaging (top image)

Nano Dimension Ltd., an additive electronics provider for electronics, announced recently that one of its customers, the Center for Biomolecular Nanotechnologies (CBN) of the Istituto Italiano di Tecnologia (IIT), is using the DragonFly additive manufacturing system to 3D print embedded sensors in electrical packaging.

IIT is a research institute in Italy, which plans to use the electrical packaging for rapid device and microsystem prototyping of next-generation micro-electro-mechanical systems (MEMS) and wearable transducers for information and communication technology (ICT) and biomedical applications.

IIT researchers will utilize their expertise in MEMS to develop reliable real-time monitoring and energy harvesters for long battery life or battery-free operation of devices.

Embedding the sensors was achieved by exploiting the DragonFly’s extremely precise multi-material inkjet deposition system that allows for simultaneous 3D printing of conductive silver nanoparticle ink (metal) and insulating ink (dielectric) via a layer-by-layer fabrication process.

The purchase of the DragonFly by IIT was facilitated by Cadlog Group, Nano Dimension’s value-added reseller in Italy, whose mission is to bring additive manufacturing solutions to the electronic industry.