Mapal, an international supplier of precision tools, manufactured a HighTorque Chuck (HTC) with narrow contour using AM in the form of selective laser melting (SLM), and succeeded in combining the benefits of the hydraulic expansion technology with the 3° back taper known from the shrink chuck.
SLM is a powder bed-based process, in which loose metal powder is melted layer by layer onto the areas where material is required from bottom to top, by means of a laser beam.
While producing the new chuck, the functional area is applied to the conventionally manufactured tool body by SLM. Using AM, the clamping range can be positioned very close to the chuck tip which is hardly possible with conventional manufacturing. This provides an optimum radial run-out of < 3 µm at the location bore and < 5 µm at 2.5 x diameter and in addition a high shape accuracy with good vibration damping. The damping in the system reduces microstructure cracking at the cutting edge, which in turn ensures longer tool life and less strain on the machine spindle. And also, AM eliminates the need for the soldered joint that has always been a limiting factor until now.
The HTC with narrow contour has all the benefits of the proven MAPAL HTC (HighTorque Chuck) technology, in which the “T” stands not only for high torque transmission, but also for thermal stability. The wide operating temperature range up to 170°C ensures additional process reliability and the balancing quality is G=2.5 at 25,000 rpm.
The new chuck offers significant benefits for mould making, automotive and aerospace applications, as the HTC with narrow contour is suitable for all machining operations in contour-critical areas and allows quick and simple clamping of the tool. Hence, training or high retooling costs or expensive peripherals are not required for implementation.
The new chuck is available in the clamping diameters of 6, 8, 10 and 12mm for HSK-A63 and SK-40. Intermediate sleeves enable additional diameter ranges to be covered. In addition, the chuck is optionally available with dynamically balanced HSK, i.e. for the first time it has become possible to dynamically balance components with HSK connection, because the mass imbalance caused by the different depths of the key block slots until now has been eliminated in the optimised HSK.