Nano Dimension Ltd., an additive electronics provider for electronics (NNDM), announced recently that it has signed a multi-year Memorandum of Understanding (MoU) with Chungbuk Technopark (CBTP) in South Korea, for research collaboration in the field of additive manufacturing of electronics.
The collaboration will focus on joint research to streamline electronics development, based on Nano Dimension’s award-winning DragonFly system. Nano Dimension will provide knowledge, technical expertise, and end-to-end support to CBTP researchers, to help integrate electronics into existing structures and improve components in terms of space, weights, and assembly.
The partnership has already resulted in novel applications for the electronics sector, including a fully functional 3D printed IoT communication device that can shorten development times for IoT devices by up to 90%. Researchers at CBTP’s premises in Cheongju have also printed capacitors in PCBs and side mount boards on the DragonFly additive manufacturing system. The extra space afforded through embedding capacitors and side mounting allows design engineers to pack more functionality on the circuit board which is particularly relevant for IoT and Industry 4.0 where customized designs and shapes are a growing demand.