PostProcess announces new 3D SLA resin removal solution

PostProcess Technologies has announced recently a revolutionary new solution for SLA resin removal as a part of its offering of automated and intelligent additive manufacturing (AM) post-print technologies. The groundbreaking PostProcess™ solution has been proven to deliver the fastest processing times on the market.

The newly developed, patent-pending PostProcess SLA resin removal solution was validated in multiple production environments with 8 different resin materials. As a part of PostProcess’ comprehensive hardware, software, and chemistry approach, the solution utilizes patent-pending SVC (Submersed Vortex Cavitation) technology in the DEMI™ and CENTI™ machines and proprietary AUTOMAT3D™ software to achieve unprecedented processing times and end part consistency.

The longevity of the PostProcess chemistry created for this solution, PG1.2, provides for resin removal on up to 1000 trays in the DEMI machine before reaching saturation. This increased longevity also reduces the costs of waste disposal and machine downtime as fewer detergent changeouts are required. The new PostProcess solution reduces the overall number of steps and chemical applications required from print to finish, driving increased productivity for technicians.