Solvay adds 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat®-Additive Manufacturing (AM) software. These products complement the neat KetaSpire® PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat®-AM platform.
Digimat®-AM allows customers to simulate the printing process and successfully predict the thermomechanical behaviour of 3D-printed designs in order to ‘print right the first time’.
These new materials will benefit from e-Xstream engineering’s Digimat®-AM Advanced Solver. This software offers highly accurate, predictive modelling data for Solvay’s AM filaments over a wide range of critical characteristics, including detailed warpage and residual stress, to help designers and engineers optimize the process and minimize part deformation before printing. For highly demanding applications, Digimat® further enables design validation by predicting the printed part performance (stiffness, strength, etc.) as a function of the material and the printing process parameters.