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3D Systems signs an agreement with CollPlant
3D Systems and CollPlant Biotechnologies announced signing a joint development agreement intended to play a pivotal role in advancing and accelerating breakthroughs in the biomedical industry.
HAL signs an MOU with Wipro 3D
HAL and Wipro 3D, the metal additive manufacturing (AM) business of Wipro Infrastructure Engineering (WIN), have signed an MOU recently to design, develop, prove out, manufacture and repair of aerospace components using metal additive technology.
Virginia Tech secures USD3.8 M from the Defense Dept.
The Department of Defense has awarded Virginia Tech researchers USD3.8 M in support of the Office of Naval Research’s Manufacturing Engineering Education Program.
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Fonon acquires manufacturing capability
Fonon Corporation declares the acquisition of FTL, LLC supporting the company’s ‘2015 Reorganization Plan’ transitioning from a development stage to a sustainable growth stage company.
James Dyson 2015 award for Voltera
Printed circuit boards (PCBs) are the electronic paths on an insulated surface that help power appliances such as smartphones, biomedical devices, and other electronic technologies.
Hexagon signs an agreement to acquire AMendate
Hexagon’s Manufacturing Intelligence division recently announced that Hexagon has entered into a definitive agreement to acquire AMendate, a German-based start-up providing simulation software solutions that support the generation and optimization of designs for additive manufacturing.